Currently, portable digital devices, foldable terminals, and micro-sensing components are continuously iterating towards thinner and smaller designs, resulting in extremely limited internal stacking space. Conventional thickness shielding fabrics occupy too much space, making it difficult to meet the requirements of compact structural layouts. Ultra-thin plain-weave EMI shielding fabric, relying on a precision weaving process using ultra-fine denier yarns, compresses the fabric thickness to the extreme. While maintaining stable electromagnetic shielding performance, it maximizes space savings within the device, making it a key flexible material for precision microelectronic packaging.

The fabric uses micron-level ultra-fine fiber warp and weft plain weave, with an overall thickness as low as 0.04mm. The fabric is dense, flat, and free of pores or protrusions, and even with multiple layers stacked, there is no significant thickness redundancy. The ultra-fine yarns, combined with a nano-level alloy conductive coating, ensure a continuous and complete conductive layer on the fiber surface, maintaining a shielding effectiveness of over 70dB across the entire frequency band, effectively blocking electromagnetic crosstalk between microchips. The fabric is flexible and bendable, making it suitable for use in confined areas subject to repeated deformation, such as foldable screen hinge cables, miniature camera modules, and wireless Bluetooth headset motherboards. Even after tens of thousands of bends, the conductive paths remain intact.

Based on ultra-thin substrates, derivative products such as ultra-thin adhesive shielding films, micro-die-cut shielding sheets, and cable wrapping shielding tapes are widely used for protecting precision components inside TWS earphones, smartwatches, and foldable phones. Its ultra-thin and lightweight characteristics increase the utilization rate of internal device space by 22%, helping terminal manufacturers further reduce body thickness and improve product portability. The R&D team continues to push the limits of weaving, continuously developing nanoscale ultra-thin shielding fabrics suitable for the development of next-generation cutting-edge products such as AR glasses and micro-implanted electronic devices.