Traditional woven conductive fabrics are dense and rigid, lacking cushioning and shock absorption properties, and cannot simultaneously meet the dual requirements of electromagnetic shielding and component shock protection. Plain-weave conductive nonwoven fabrics, formed using a nonwoven process, rely on a loosely stacked structure of randomly arranged fibers to simultaneously possess conductive shielding, cushioning, shock absorption, and lightweight properties, making them a new mainstream material for transporting precision electronic components and for internal equipment cushioning and shielding.

Plain-weave conductive nonwoven fabrics utilize a hot-melt nonwoven molding process. The polyester fiber base is arranged in a disordered, interwoven pattern, resulting in a loose and soft overall texture with abundant internal pores. Under pressure, it can efficiently absorb the impact of vibration, effectively preventing damage to chips and circuit boards caused by transport bumps and equipment vibrations. Conductive metal particles are uniformly attached to the surface of each fiber, and the fibers interlock to form continuous conductive paths, achieving stable electromagnetic shielding throughout the entire area, with a shielding effectiveness range of 65~85dB. Compared to woven fabrics, nonwoven fabrics are 30% lighter, with no fraying or yarn shedding during cutting and processing, higher waste utilization, and more economical processing costs.

Based on the substrate, it can be processed into derivative products such as packaging liners for electronic components, buffer shielding felts for battery modules, and shielding liners for portable instruments. These are widely used in the warehousing and transportation of consumer electronics components, buffer protection for energy storage cell modules, and linings for handheld testing instruments. The products possess excellent moisture-proof and breathable properties; the sealed packaging prevents condensation and moisture absorption, ensuring long-term dryness and cleanliness of components. The R&D team continuously adjusts the fiber weight and conductive filler ratio, launching high-density thickened versions and ultra-thin lightweight models in multiple specifications to meet different buffering and shielding requirements, continuously expanding the application scenarios for lightweight buffer electromagnetic protection.